What seemed almost impossible a few years ago is beginning to take shape: Apple could rely on the Intel 18A-P node to manufacture some of its future Apple Silicon chips starting in 2027.This would not be a return to Intel x86 processors, but a shift in which the Cupertino company would continue to design its own SoCs, but delegate the production of some models to Intel's factories.
According to several supply chain reports, led by the analyst Ming-Chi KuoApple has reportedly already taken concrete steps to evaluate the process Intel 18A-P as the basis for the entry-level M-series chipsThat is, those intended for entry-level or mid-range laptops and tablets. The deal would fit into a broader industrial diversification strategy in which TSMC would remain the main partner, but no longer the only one.
Intel 18A-P: the node chosen for entry-level Apple Silicon
Leaks suggest that Apple was reportedly specifically interested in Intel Foundry's 18A-P node for lower-power M chipsThat is, those intended for entry-level or mid-range laptops and tablets. We're not talking about the most ambitious SoCs for MacBook Pro or Mac Studio, but rather the processors that power more popular devices like the MacBook Air or certain iPad models.
According to Kuo, the starting point was Apple's access to a preliminary version of the process development kit, the PDK 18A-P 0.9.1GAWith this package, the company would have been able to already carry out key design simulations in terms of yield, consumption and area (PPA), obtaining results aligned with internal expectations.
The work plan now includes the arrival of the Intel PDK 1.0 and 1.1 18A-PThese versions, which are expected to be available in the first quarter of 2026, will allow Apple engineers to fine-tune the design of the M chips on the final node before moving on to more advanced validation phases.
Kuo himself points out that the preliminary schedule considers the possibility that Intel will begin shipping the first Apple Silicon chips based on the 18A-P chip between the second and third quarters of 2027.Even so, he insists that adoption is not completely closed and will depend on Intel meeting its technical and production targets in the coming years.
A leading-edge process with Foveros Direct and a focus on efficiency
Within Intel's roadmap, 18A-P is presented as one of the most advanced and strategic nodesIt was publicly detailed at the Intel Direct Connect 2025 event and is situated in the range of nodes equivalent to about 2 nanometers, with significant improvements in density and power consumption compared to previous generations.
One of the most relevant aspects is that 18A-P is Intel's first process compatible with Foveros Direct and 3D hybrid bondingThis technology allows chiplets to be stacked using TSVs (through-the-silicon vias) with a pitch of less than 5 microns, facilitating more compact and efficient modular designs, something especially interesting for complex SoCs such as those in the M family.
In addition, the variant The 18A-P is designed to operate across multiple power and voltage ranges.with adjusted thresholds to balance performance and energy efficiency. This approach aligns well with Apple Silicon's philosophy, which aims to maximize battery life without sacrificing sustained high performance, a point highly valued by MacBook and iPad users in Spain and the rest of Europe.
On paper, The combination of Apple's design and 18A-P lithography would position these entry-level chips as a very competitive option in terms of energy efficiency.However, until the validation and real silicon sampling phases are completed, everything remains in the realm of forecasts.
Which M-chips would Intel manufacture and how do they fit into the roadmap?
The sources agree that Intel's role would focus on the entry-level M-Seriesleaving the more powerful configurations under TSMC's responsibility. In practice, this would mean that the standard processors (the "M" models) would be manufactured in Intel's plants, while the Pro, Max, and Ultra variants would continue to be produced in the factories of their Taiwanese partner.
Looking at the release history, Apple unveiled the M3 in October 2023, the M4 in May 2024, and the M5 is expected in October 2025.If this pace is maintained, the M6 should arrive around 2026, as well as the M7 would be located in the late 2027 or even early 2028 range, just as Intel aims to be ready to produce M chips with 18A-P.
In that context, several reports indicate that The first logical candidate to debut in Intel's factories would be the entry-level M7 chipThis would fit with the idea that the more affordable models, which are sold in higher volumes, would take advantage of the additional production capacity that Intel Foundry Services would offer.
These SoCs would be intended for devices such as MacBook Air, iPad Air and some iPad Pro plus contentas well as possibly certain entry-level desktop Macs. Meanwhile, the variants M7 Pro, M7 Max or future Ultra versions They would remain in the hands of TSMC, which would continue to focus on chips with the highest performance demands.
Regarding specific figures, Kuo speaks of an estimated volume of between 15 and 20 million M chips manufactured by Intel in 2027This scale would immediately make Apple one of Intel Foundry's most important customers, justifying some of the American company's heavy investments in advanced nodes.
An Apple-Intel reunion with very different roles
For more than a decade, Macs relied entirely on Intel processorsuntil Apple initiated and completed the transition to Apple Silicon based on Arm architecture. That move was interpreted as a definitive break, driven by the need for performance per watt and total control over the silicon design.
With the possible adoption of 18A-P, The paths of Apple and Intel would cross again, but with a completely different cast of roles.This time, Apple would remain in charge of the design and architecture of its chips, while Intel would simply act as a foundry, just as TSMC does today.
This means that There would be no return to x86 processors or the power and heat limitations that plagued some Macs in the past.The devices would continue to use Apple Silicon with custom-designed Arm cores, optimized for macOS and iPadOS, simply manufactured in different factories.
For the user, the presence of Apple Silicon chips "made by Intel" in MacBook and iPad It would be virtually transparent. What will matter is performance, battery life, and thermal stability, regardless of whether the silicon was produced at an Intel or TSMC plant.
In markets like Spain, where MacBook Airs and iPads have established themselves as key devices in educational, creative, and professional environments.This change could be most noticeable in product availability and the regularity of range renewals.
An exclusive NDA and a schedule adjusted until 2027
To get to this point, reports indicate that Apple has reportedly already signed an exclusive non-disclosure agreement (NDA) with Intel regarding the 18A-P node.This contractual framework allows for the sharing of sensitive information about the manufacturing process and access to preliminary versions of the design kits needed to work on the node.
Specifically, it states that Apple has already had access to the 18A-P PDK 0.9.1GAThis package enables initial design simulations and feasibility tests. The initial results in performance, consumption, and area metrics have reportedly been positive, which would explain the growing interest from the Cupertino company.
Intel's roadmap anticipates publishing PDK versions 1.0 and 1.1 during the first quarter of 2026These iterations are key because they usually include more mature libraries, refined electrical models, and definitive design rules, allowing customers like Apple to finalize the last details of their SoCs.
If the deadlines are met, Intel could begin shipping the first entry-level M processors between the second and third quarters of 2027.It is a relatively tight margin for such a complex node, so any significant delay in process development or production ramp-up could shift the schedule.
Kuo himself clarifies that, despite Apple's apparent enthusiasm after these initial tests, The final adoption of node 18A-P is not 100% guaranteedThe final decision will depend on the performance of the upcoming PDKs, manufacturing yields, and Intel's ability to produce at scale while maintaining the required quality.
TSMC remains the main pillar, but no longer the only one.
Today, TSMC manufactures all of Apple Silicon chips and virtually all of the company's SoCsincluding the A series for iPhone and the M series for Mac and iPad. This close relationship has allowed Apple to consistently utilize cutting-edge processes and achieve a high degree of optimization between design and manufacturing.
However, Concentrating all advanced production in a single Taiwan-based supplier involves risksThis is due to both potential production bottlenecks and geopolitical factors or unforeseen events that may affect the region.
Intel's potential entry as a second reference foundry would allow Apple to distribute the workload and reduce its dependence on TSMC in certain segmentsThe idea is not to break the current relationship, but to create a working scheme where TSMC remains the main partner for the highest-performance chips and for iPhones, while Intel takes care of the basic M-Series.
In parallel, some analyses suggest that Apple could even slightly reduce the weight of the lower-end M chips in its catalog, exploring new product combinations such as iPhone-based laptops based on SoCs from 2026In that scenario, Intel's contribution would make even more sense to absorb the demand for models that remain in the entry-level M range.
For TSMC, the impact would be limited: will continue to serve as Apple's core partner in the most advanced nodeswith high-value orders tied to iPhone SoCs and the most powerful Apple Silicon for Macs. If anything, the added competitive pressure could accelerate new investments and process improvements.
What does Intel gain by betting on 18A-P for Apple?
From Intel's perspective, Closing a production deal with Apple for node 18A-P would be a huge boost for its foundry businessIntel Foundry Services. After years of lagging behind TSMC in advanced nodes, getting a company as demanding as Apple to commit to their technology would be proof that they have managed to close the gap.
Beyond prestige, to secure a potential volume of between 15 and 20 million M chips per year This would guarantee a very high occupancy rate of the production lines in 18A-P. This helps to amortize multimillion-dollar investments in new factories and equipment, especially in plants located in the United States.
There is also a symbolic component: Intel would go from being the platform that Apple left behind in 2020 to becoming the basis of part of its future Apple SiliconAlthough the role is different —it no longer designs the chips, it only manufactures them—, the change in the narrative would be notable both in terms of image and competitive positioning against TSMC and Samsung.
If the project goes well and Apple is satisfied, Other major chip designers might be more inclined to entrust advanced nodes to Intel.Companies like Nvidia, AMD, and other fabless players, including some European ones, could see Intel Foundry as a real alternative to diversify their own supply chains.
In short, for Intel this potential agreement is not just another contract, but rather This could mark the relaunch of its foundry strategy as a top-tier player in cutting-edge semiconductors..
Geopolitical reading and effects in Spain and Europe
The political dimension of this movement is also significant. Intel is primarily manufacturing nodes like the 18A-P in factories located in the United States., relying on public incentive programs and a discourse of technological reindustrialization that seeks to reduce dependence on Asia.
For Apple, to move part of the production of its M chips to US soil This allows them to align with Washington's "Made in USA" priorities. It's an argument that can be useful with governments of different profiles, as it demonstrates a commitment to local manufacturing of a critical component of their devices.
In parallel, Europe is advancing its own semiconductor strategy through the European Chips ActThis initiative aims to attract investment and establish advanced manufacturing facilities in several EU countries. However, the potential collaboration between Apple and Intel underscores that, for the time being, the most cutting-edge technology hubs will remain primarily concentrated in the United States and Asia.
For users in Spain and other European countries, the effect will be felt indirectly. If Apple succeeds to better distribute its manufacturing between TSMC and IntelIt should be easier to maintain a constant flow of products like MacBook Air, iPad or entry-level Mac in physical stores and online channels, avoiding stock shortages like those seen in other industries.
Regarding prices, it's still too early to know if Having two advanced chip suppliers will allow Apple to reduce costs Or at least better contain potential price increases. It's logical to think that greater competition and increased installed capacity would contribute to greater stability, which would benefit the European market as a whole.
Everything points to the fact that, if Intel manages to make its node 18A-P is ready on time and with the quality levels required by AppleFrom 2027 onwards, we could begin to see Macs and iPads with Apple Silicon designed in Cupertino but manufactured in Intel plants. For the industry, this would represent a significant realignment of the global semiconductor manufacturing landscape, while for users in Spain and Europe, the change would be most noticeable in a more stable range of devices, with predictable upgrade cycles and fewer availability issues, in a context where chip technology continues to advance rapidly.
